P498 – HV sputter deposition Nanocomp
Application
HV inline sputter deposition system for thin film deposition at special sized substrates
Year of delivery
2022
Installation site
Nanocomp Oy Ltd, Lehmo, Finland
Design Features
- Inline HV magnetron sputter deposition system with full automatic control system.
- One 28″ x 3.5″ rectangular magnetron in face to face configuration.
- Magnetron mounted at a flipping door for fast and easy target exchange and source cleaning.
- Direct gas inlet close to the target installed at each magnetron.
- Pneumatic driven source shutter.
- Motorized sample trolley with variable constant speed motion mode.
- Wobbling motion in front of the magnetron possible.
- Maximal sample size of 508mm x 508mm x 5mm.
- Three big system access doors.
- One towards clean room for sample loading and unloading.
- One towards gray room for easy service access mainly.
- One for service at the sputter soruce or deposition region of the system.
- Software controlled upstream pressure regulation system.
Special Features
- Large motion speed range from < 0.1 mm/s up to > 50mm/s possible.
Outer Dimensions
Technical specifications and performance values
General
Sputtering chamber
Size
Cubic shape chamber, about 2000 mm length, about 650 mm width & about 1500 mm height
Material
stainless steel
Vacuum
Sputtering chamber
Base pressure
< 3 *10-7 mbar
Pump down time
10 hours to < 10-6 mbar
Chamber pumping
Turbo pumping stage with dry foreline pump
Manipulator features
Sputtering chamber
Sample size
max. 508mm x 508mm x 5mm special shaped samples
Motion axes
Motorized sample translation axis with motion speed range of min. 0.1 mm/s up to max. 50 mm/s, incl. sample position wobbling feature
Performance test results
Chamber pump down
Sputter process stability
