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P372 – 2″ HV sputter deposition JMI


HV sputter deposition system for thin film and multilayer deposition at 2″ substrates

Year of delivery


Installation site

JMI, New Dehli, India

Design Features

  • HV magnetron sputter deposition system with combination of confocal and face to face sputter up configurations.
  • Up to six 2″ magnetrons in confocal configuration and max. one 2″ magnetron in face to face configuration.
    • All magnetrons with manual in situ tilting.
    • All magnetrons with easy changeable magnetic system for use with ferromagentic or non-ferromagnetic target materials.
  • Sample manipulator with motorized sample roation, integrated pneumatic shutter, RF sputter cleaning and maximal sample temperature above 800°C.
  • Integrated bake out system.

Special Features

  • System is prepared for adding a load lock chamber.
  • System is prepared to be added to a cluster tool via second transfer port at sputtering chamber.
  • Different sample sizes from 2″ wafer down to 10mm x 10mm samples can be handled (using different kind of sample adapters).

Outer Dimensions

Technical specifications and performance values


Sputtering chamber


450 mm diameter, about 750 mm height


stainless steel


Sputtering chamber

Base pressure

< 4 *10-8 mbar

Pump down time

3 hours to < 3 * 10-7 mbar

Chamber pumping

Turbo pumping stage, door differentially pumped by dry foreline pump

Bake out

< 150°C

Manipulator features

Sputtering chamber

Sample size

diameter max. 2″ substrate

Motion axes

motorized (continous) sample stage rotation

Pneumatic shutter (part of the manipulator head)


Room temperature (stabilized) up to 800°C at sample

Special features

RF bias / plasma cleaning possible

Performance test results

Chamber pump down
Long time sample heating
Deposition uniformity (confocal sputtering)
RGA spectrum at base pressure